Features:

• BAKU BGA Soldering Solder Welding Paste.
• It use new technical support, the unique chemical formulations provide excellent wetting, ensuring high reliability.
• Efficient use of the thixotropic agent, can effectively prevent the collapse of the solder printing and special preheating the printing and to ensure good fine pattern.
• Because use more advanced insulation technology, tack lasting, so it is easy to dry, sticky lasted more than 48 hours.
• High quality and unique formula, perfect performance, easy to weld, solder bright and full, no solder false phenomena.
• The residue was colorless and transparent, does not affect the excellent detection, disposable and cleaning performance.
• Product moist and good, strong anti-dry at room temperature shelf life longer, adapted to mobile phone repair industry, digital computer repair industry, high-precision circuit board SMT soldering, BGA soldering process so

Specification:

• Product:051G
• Alloy:Sn63/Pb37
• Microns: 25-45um
• Hi-Performance
• No-Clean
• Storage Condition:0-10°c
• Weight: 50g

Note:

• Harmful by inhalation and if swallowed.
• Danger of cumulative effects.
• Keep away from food, drink and animal feeding stuffs.
• When using do not eat, Drink or smoke.
• Avoid prolonged or repeated contact of any skin with solder paste. In case of solder paste ingestion see a doctor immediately.
• Store container well closed and cool.

Package Include:

• 1 x BAKU BGA  BK-051G 50gm Soldering Paste Flux Grease SMT Repair Tools Solder Paste Repairing Solder Soldering Paste Flux Easy Welding For SMD PGA PCB Rework Repair